Chip Quik 991 Series Thermally Stable Solder Paste Water-Soluble (T4) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F Water-Soluble in 35g/10cc syringe with plunger and tips.
Revolutionary Formula: No Refrigeration Required!
Specifications
Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic Water-Soluble
Flux Classification: REM0 (Residue must be water-washed at 60C+ after reflow)
Metal Content: 87% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 138C (281F)
Size: 35g/10cc syringe
