ChipQuik Thermally Stable Solder Paste WS (Water-Soluble) Sn42/Bi57.6/Ag0.4 T4 (35g syringe)


Chip Quik 991 Series Thermally Stable Solder Paste Water-Soluble (T4) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F Water-Soluble in 35g/10cc syringe with plunger and tips.

Revolutionary Formula: No Refrigeration Required!


Alloy: Sn42/Bi57.6/Ag0.4

Flux Type: Synthetic Water-Soluble

Flux Classification: REM0 (Residue must be water-washed at 60C+ after reflow)

Metal Content: 87% metal by weight.

Particle Size: T4 (20-38 microns)

Melting Point: 138C (281F)

Size: 35g/10cc syringe