Chip Quik 991 Series Thermally Stable Solder Paste Water-Soluble Lead-Free SAC305 in 35g/10cc syringe with plunger and tips.
Revolutionary Formula: No Refrigeration Required!
Specifications
Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic Water-Soluble
Flux Classification: REM0 (Residue must be water-washed at 60C+ after reflow)
Metal Content: 86% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 217C (423F)
Size: 35g/10cc syringe
